Hua Hong Semiconductor’s 3rd-Generation 90nm eFlash Process Platform Successfully Achieved Mass Production

HONG KONG, Jun 27, 2019 – (ACN Newswire) – Hua Hong Semiconductor Limited (“Hua Hong Semiconductor” or the “Company”, stock code: 1347.HK), a global leading specialty pure-play foundry, announced that its 3rd-generation 90nm embedded flash (90nm eFlash) process platform has successfully achieved mass production.

Hua Hong Semiconductor continued to improve the competitiveness in the field of embedded Non-Volatile Memory (eNVM) technology. Through continuous technological innovation, the flash cell size of the 3rd-generation 90nm embedded flash process platform is reduced by nearly 40% compared with the 2nd-generation technology, hitting a record low in the embedded flash technology at 90nm process node among foundries worldwide. Flash IP has a more obvious advantage in area, which further reduces the overall chip size, resulting in a greater number of dies on a single wafer. At the same time, the number of mask layers is further reduced, effectively shortening the manufacture cycle. While reliability is maintained at a high level, reaching 100,000 write/erase cycles and data retention for 25 years. In recent years, Hua Hong Semiconductor has successfully launched three generations of eflash process platforms at 90nm process node, striving to develop more cost-effective solutions while maintaining technical leadership. The stable mass production of the 3rd-generation eFlash platform provides continuous and stable support and solutions for smart cards and security chip products such as SIM card, Ukey and traffic card as well as diversified products such as microcontroller.

Dr. Kong Weiran, Executive Vice President of Hua Hong Semiconductor, said, “As a leader in eNVM technology, Hua Hong Semiconductor will continue to focus on the research and development of 200mm differentiation technology, aim for the market of high-density smart cards and high-end microcontrollers, provide significant optimization in terms of power consumption and chip size, and extend the existing technical advantage of 200mm to 300mm, to serve the domestic and overseas design houses better and satisfy the market needs.”

About Hua Hong Semiconductor Limited
Hua Hong Semiconductor Limited (“Hua Hong Semiconductor”, stock code: 1347.HK) (the “Company”) is a global leading pure-play foundry with specialty process platforms uniquely focused on eNVM, power discrete, analog & power management and logic & RF. Of special note is the Company’s outstanding quality control system that satisfies the strict requirements of automotive chip manufacturing. Hua Hong Semiconductor is part of the Huahong Group, which is an important member of China’s 909 Project. With semiconductor manufacturing as its core business, the Huahong Group is a high-tech, globally oriented, highly competetive enterprise with innovative capabilities.

The Company presently operates three 200mm wafer fabrication facilities within the Huahong Group (HH Fab1, HH Fab2 and HH Fab3) in Jinqiao and Zhangjiang, Shanghai, with a total monthly 200mm-wafer capacity of 175,000 wafers. There is also a new 300mm-wafer fabrication facility (HH Fab7) being built in Wuxi’s National High-Tech Industrial Development Zone. When completed, the Wuxi fab will increase the Company’s monthly capacity by forty thousand 300mm wafers.

For more information, please visit: www.huahonggrace.com


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